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October 10, 2008

Schneider Electric, ELAU expand Packaging Solutions at PACK EXPO

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Schneider Electric and its packaging specialist, ELAU, will highlight the expanded capabilities at PACK EXPO Booth E-6413.

New product announcements for PACK EXPO 2008 emphasize ease of packaging systems design, integration, operation and maintenance:

• Turnkey control cabinet modules, delivered with all hardware and software pre-installed and ready to run. Combined with Intelligent Servo Modules, the cabinets can save 30 to 70% in required cabinet space.

• New software interfaces for seamless integration with Schneider Electric variable frequency drives, integrated stepper drives, modular I/O systems, motor protection devices and HMI panels and industrial PCs, as well as Cognex® vision systems.

• New Magelis® HMI panels have been introduced that integrate directly with ELAU controllers with now need for a Windows™ PC or OPC server.

• New, simplified control programming in PacDrive Pilot™, combining familiar, IEC-conforming ladder logic with an easy-to-use software object library optimized for packaging machinery.

• New two-axis delta robot arms powered by servo modules and requiring no kinematics skills to program, letting OEMs embed robotic functionality in their case packers and other secondary packaging machinery.

• New ELAU software capabilities include patent-pending Intelligent Line Shafting™ to smooth out difficult motion profiles, AutoTune™ to optimize the most difficult 10% of applications, advanced robotic motion, a new high speed soft PLS (programmable limit switch), and the ability to drive new torque motors and linear motors.

• Sensing technologies ideal for packaging applications include the new XUV fork ultrasonic label sensor for label, ply, double-sheet, splice and wrinkle/seam detection.




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