At PACK EXPO Booth S-5414, ELAU will combine video, animation and live demonstrations to help visitors understand the potential of its game-changing PacDrive™ Intelligent Servo Module technology to take packaging efficiency and flexibility to the next level.

No other automation supplier offers an equivalent solution, and no other supplier offers an automation platform purpose-built for packaging.

Visionary machine builders are exploiting the technology not only to streamline their machinery, but to substantively change the way that packaging systems benefit lean manufacturing, supply chain management and product marketing initiatives.

This modularity replaces the concept of isolated machine builders with packaging systems providers, a new breed of innovation-driven solution partners. Instead of installing stand-alone machines into a packaging line with minimal synchronization, ELAU’s PacDrive automation platform enables a collaborative, multi-vendor systems approach that is rapidly gaining favor with both packaging systems providers and users.

To reinforce ELAU’s longstanding commitment to open architectures upon which its PacDrive automation system is based, the company will once again be a demonstration sponsor at the OMAC Packaging Workgroup booth.

More ELAU-enabled packaging system providers at PACK EXPO are also taking advantage of a complete Schneider Electric electrical solution that provides a welcome alternative to the limitations of status-quo single-source supply arrangements. Both packaging system providers and their customers are finding the Schneider supply chain commercially advantageous and uncompromising in quality.

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