PACK EXPO Las Vegas just keeps getting bigger and better.

High level packaging system specifiers are abundant. A number of new machines will be introduced, as you’ll see in this issue of PA.

There’s a lot to pack into a 3-day show in Vegas, but the official floorplan makes it easy to find machinery providers leveraging PacDrive automation technology from ELAU (PELV Booth S-5414)—by both listing and highlighting them. There’s also a handy listing with Web links on Screen 8 of this issue.

You’ll find that the wave of modularity reported by ARC prior to the last PELV is rolling along, with significant advances on three fronts: software, hardware and mechanical modularity. The more advanced designs are becoming plug-and-play packaging systems, as ARC described in its PACK EXPO/interpack preview report on servo modules.

And it’s not all work. There’s the PMMI golf tournament benefiting packaging education, the Conference at PACK EXPO and the Packaging Hall of Fame induction ceremony. These events combine the networking, knowledge transfer and recognition that the packaging community looks forward to at PELV.