A new report form ARC Advisory Group, ‘Taking Modularity to the Next Level in Packaging Machine Design,’ describes breakthrough modular servo technology coming to the market from ELAU.

The report states that to be competitive, “it is imperative to evaluate iSH (intelligent servo module) technology because otherwise an OEM’s machine designs will end up lagging the state of the art in the market.”

Timing for machine builders is critical because, the report continues, “It is our belief that at the next series of international shows, customers will be seeking out machinery that has leveraged the capabilities of iSH technology. OEMs should not be satisfied with what they have always delivered, because their customers certainly will not be.”

The trade shows referred to are PACK EXPO 2007, October 15-17 and interpack 2008, April 24-30.

The report states that the technology is ‘light years beyond’ previous attempts and urges packaging machine OEMs to deploy ‘without delay to gain first-mover advantage.’

The PACK EXPO preview issue of Packaging Automation will report on machine builders introducing servo module-enabled machines at the show.

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