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July 15, 2006

This Year's Hot Topic: Packaging Automation

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From ARC Forum to PackOps, Packaging Strategies to IPACK IMA, and the all-new Packaging Automation Forum, packaging automation has become this year’s hot topic. Why all the interest?

Business managers are coming to recognize the potential of packaging to add profit to their operations. It’s a message attracting attendees to both new and time honored symposia in the U.S. and Europe.

Applying the technology is straightforward. But identifying the right technology from vendors’ claims requires a careful analysis. The greatest challenge has proved to be human nature— resistance to change—according to commentators.

At the plant level, success requires letting go of 30 years of very linear PLC programming to embrace modular software. In purchasing, the breakthroughs involve changing from obsolete control specifications to accepting standards-based solutions from qualified global sources based on the machine builder’s best advice.

Read on, you’ll find the news encouraging.




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